(I) Ka manaʻo oepoxy resin
ʻO ka resin epoxy e pili ana i ke kaulahao polymer i loaʻa i ʻelua a ʻoi aku nā pūʻulu epoxy i loko o nā pūhui polymer, nona ka resin thermosetting, ʻo ka resin representasi he bisphenol A ʻano epoxy resin.
(II) Nā hiʻohiʻona o nā resins epoxy (i kapa mau ʻia ʻo bisphenol A type epoxy resins)
1. He haʻahaʻa loa ka waiwai o ka noi epoxy resin, pono e hoʻohana pū me ka mea ho'ōla e loaʻa ka waiwai kūpono.
2. ʻO ka ikaika hoʻopaʻa kiʻekiʻe: ʻo ka ikaika hoʻopaʻa ʻana o ka epoxy resin adhesive ma ke alo o nā synthetic adhesives.
3. Curing shrinkage mea uuku, ma ka epoxy resin adhesive shrinkage ka mea liilii loa, a me ka epoxy resin adhesive curing adhesive kiʻekiʻe kekahi o nā kumu.
4. ʻO ke kūpaʻa kemika maikaʻi: ʻo ka hui ether, ke apo benzene a me ka hui aliphatic hydroxyl i loko o ka ʻōnaehana hoʻōla ʻaʻole hiki ke hoʻopau ʻia e ka waikawa a me ka alkali. I ka wai kai, ka aila, ka aila, 10% H2SO4, 10% HCl, 10% HAc, 10% NH3, 10% H3PO4 a me 30% Na2CO3 hiki ke hoohana no na makahiki elua; a i loko o 50% H2SO4 a me 10% HNO3 immersion ma ka lumi wela no ka hapalua makahiki; 10% NaOH (100 ℃) immersion no hoʻokahi mahina, ʻaʻole i loli ka hana.
5. ʻOi aku ka maikaʻi o ka uila uila: hiki ke ʻoi aku ka nui o ka haʻihaʻi o ka epoxy resin ma mua o 35kv / mm 6. ʻO ka hana maikaʻi o ka hana, ka nui o ka huahana, kūpaʻa maikaʻi a me ka haʻahaʻa haʻahaʻa wai. ʻO ka maikaʻi o ka bisphenol A-type epoxy resin maikaʻi, akā aia nō kona mau hemahema: ①. ʻO ka viscosity hana, i ʻike ʻia he mea kūpono ʻole i ka hana ②. He palupalu nā mea i hoʻōla ʻia, liʻiliʻi ka elongation. ③. Ka ikaika peel haʻahaʻa. ④. Ke kū'ē maikaʻiʻole i ka mechanical a me ka wela.
(III) ka noi a me ka hoʻomohala ʻana oepoxy resin
1. ʻO ka mōʻaukala hoʻomohala o ka resin epoxy: ua noi ʻia ka epoxy resin no ka patent Swiss e P.Castam i ka makahiki 1938, ua hoʻomohala ʻia ka epoxy adhesive mua loa e Ciba ma 1946, a ua hoʻomohala ʻia ka epoxy coating e SOCreentee o USA i 1949, a ua hoʻomaka ʻia ka hana ʻana o ka epoxy resin ma 1958.
2. Ka hoʻohana ʻana i ka resin epoxy: ① ʻO ka ʻoihana hoʻopili: ʻo ka epoxy resin i ka ʻoihana hoʻopiʻi e koi i ka nui o ka nui o ka wai i hoʻopaʻa ʻia i ka wai, ʻoi aku ka nui o ka hoʻohana ʻia ʻana o ka pauka a me ka paʻa paʻa kiʻekiʻe. Hiki ke hoʻohana nui ʻia i nā ipu pipeline, nā kaʻa, nā moku, aerospace, electronics, nā mea pāʻani, nā mea hana a me nā ʻoihana ʻē aʻe. ② ʻoihana uila a me ka uila: hiki ke hoʻohana ʻia ka epoxy resin adhesive no nā mea hoʻokalakupua uila, e like me nā mea hoʻoponopono, nā mea hoʻololi, ke hoʻopaʻa ʻana i ka ipuhao; ka hoʻopaʻa ʻana a me ka pale ʻana i nā mea uila; nā huahana electromechanical, insulation a me ka hoʻopaʻa ʻana; ka hoʻopaʻa ʻana a me ka hoʻopaʻa ʻana i nā pā; capacitors, resistors, inductors, ka ʻili o ka ʻahuʻula. ③ ʻO nā mea gula, nā mea hana, nā ʻoihana haʻuki: hiki ke hoʻohana ʻia no nā hōʻailona, mea nani, nā hōʻailona, mea hana, nā rackets, nā mea lawaiʻa, nā mea haʻuki, nā mea hana a me nā huahana ʻē aʻe. ④ ʻOihana Optoelectronic: hiki ke hoʻohana ʻia no ka encapsulation, ka hoʻopiha a me ka hoʻopaʻa ʻana o nā kukui-emitting diodes (LED), nā pahu kikohoʻe, nā pika pika, nā hōʻike uila, nā kukui LED a me nā huahana ʻē aʻe. ⑤ ʻOihana hana: E hoʻohana nui ʻia ia ma ke alanui, ke alahaka, ka papahele, ka hale kila, ke kūkulu ʻana, ka uhi ʻana i ka pā, ka pā, ka hana ʻenekinia, ka hoʻoponopono ʻana i nā moʻomeheu moʻomeheu a me nā ʻoihana ʻē aʻe. ⑥ Nā mea hoʻopili, nā mea hoʻopaʻa a me nā mea hoʻohui: e like me ka makani turbine blades, nā mea hana lima, nā seramika, nā aniani a me nā ʻano ʻano like ʻole o ka hoʻopaʻa ʻana ma waena o nā mea, carbon fiber sheet composite, microelectronic material sealing a pēlā aku.
(IV) Nā hiʻohiʻona oepoxy resin adhesive
1. Hoʻokumu ʻia ka epoxy resin adhesive i nā hiʻohiʻona epoxy resin o ka hoʻoponopono hou ʻana a i ʻole ka hoʻololi ʻana, no laila, ʻo kāna mau ʻāpana hana e like me nā koi kikoʻī, maʻamau ka epoxy resin adhesive pono pū kekahi e loaʻa i kahi lāʻau lapaʻau me ka hoʻohana ʻana, a pono e hui pū ʻia i mea e hoʻōla piha ʻia, maʻamau epoxy resin adhesive i ʻike ʻia ʻo ka curing Blue a i ʻole ka mea hana kumu nui.
2. e noʻonoʻo ana i nā hiʻohiʻona nui o ka epoxy resin adhesive ma mua o ka hoʻōla ʻana, ʻo ia ka: kala, viscosity, gravity kikoʻī, ratio, manawa gel, manawa loaʻa, manawa hoʻōla, thixotropy (stop flow), paʻakikī, ʻili ʻili a pēlā aku. ʻO Viscosity (Viscosity): ʻo ia ke kū'ē kū'ē kūloko o ka colloid i ke kahe, ua hoʻoholo ʻia kona waiwai e ke ʻano o ka mea, ka mahana, ka ʻike a me nā mea ʻē aʻe.
Ka manawa gel: ʻO ka ho'ōla ʻana o ke kāpili ke kaʻina o ka hoʻololi ʻana mai ka wai a hiki i ka solidification, mai ka hoʻomaka ʻana o ka hopena o ke kāpili a hiki i ke kūlana koʻikoʻi o ka gel i ka manawa paʻa no ka manawa gel, i hoʻoholo ʻia e ka hui ʻana o ka epoxy resin glue, ka mahana a me nā mea ʻē aʻe.
Thixotropy: Keia hiʻona pili i ka colloid i hoʻopāʻia e waho ikaika (naueue, hoʻouluulu, vibration, ultrasonic nä hawewe, etc.), me ka ikaika o waho mai ka manoanoa a hiki i ka lahilahi, i ka wa o na kumu o waho e hooki i ke kuleana o ka colloid e hoʻi i ke kumu i ka like o ka hanana.
ʻoʻoleʻa: pili i ke kū'ē o ka mea i nā mana o waho e like me ka embossing a me ka scratching. E like me nā ʻano hoʻokolohua like ʻole ʻo Shore (Shore) hardness, Brinell (Brinell) hardness, Rockwell (Rockwell) hardness, Mohs (Mohs) hardness, Barcol (Barcol) hardness, Vickers (Vichers) hardness a pēlā aku. ʻO ka waiwai o ka paʻakikī a me ka paʻakikī ʻano ʻano e pili ana i ka mea hoʻāʻo paʻakikī maʻamau, He maʻalahi ke ʻano o ka hoʻāʻo ʻana o ka paʻakikī Shore, kūpono no ka nānā ʻana i ka hana, Hiki ke hoʻokaʻawale ʻia ka mea hōʻike paʻakikī Shore i A ʻano, ʻano C, ʻano D, A-type no ke ana ʻana i ka colloid palupalu, C a me D-ʻano no ke ana ʻana o ka colloid semi-paʻakikī a paʻakikī.
ʻO ka ʻili o ka ʻili: ka huki ʻana o nā molekala i loko o ka wai i hiki ai i nā molekala ma luna o ka ʻili o loko ke ikaika, e hana kēia ikaika i ka wai e like me ka hiki ke hoʻemi i kona ʻili a me ka hoʻokumu ʻana o ka parallel me ka ʻili o ka ikaika, i ʻike ʻia ʻo ka ʻili o ka ʻili. A i ʻole ka traction like ʻana ma waena o ʻelua mau ʻāpana pili o ka ʻili o ka wai no ka lōʻihi o ka lōʻihi, he hōʻike ia o ka ikaika molekala. ʻO ka ʻāpana o ka ʻili o ka ʻili he N/m. ʻO ka nui o ka ʻili o ka ʻili e pili ana i ke ʻano, ka maʻemaʻe a me ka mahana o ka wai.
3. e hoike ana i na ano oepoxy resin adhesivema hope o ka mālama ʻana i nā hiʻohiʻona nui: ke kū'ē, ka uila, ka wai absorption, compressive ikaika, tensile (tensile) ikaika, shear strength, peel strength, impact strength, heat distortion temperature, glass transition temperature, internal stress, chemical resistance, elongation, shrinkage coefficient, thermal conductivity, uila conductivity, weathering, aging resistance, a pēlā aku.
Kūʻē: E wehewehe i nā hiʻohiʻona kūʻokoʻa mea maʻamau me ke kū ʻana o ka ʻili a i ʻole ke kūpaʻa leo. ʻO ke kūʻē ʻana o ka ʻili he ʻili like ma waena o nā electrodes ʻelua i ana i ka waiwai kūʻē, ʻo Ω ka mea. Hiki ke helu ʻia ke ʻano o ka electrode a me ka waiwai kū'ē ma ka hoʻohui ʻana i ka resistivity ili ma kēlā me kēia ʻāpana. ʻO ke kū'ē leo, i ʻike ʻia ʻo ka volume resistivity, volume resistance coefficient, e pili ana i ka waiwai kū'ē ma o ka mānoanoa o ka mea, he hōʻailona koʻikoʻi e ʻike i nā waiwai uila o nā mea dielectric a insulating. He kuhikuhi koʻikoʻi ia e ʻike ai i nā waiwai uila o nā mea dielectric a i ʻole insulating. ʻO 1cm2 dielectric kū'ē i ka leakage au, ʻo Ω-m a i ʻole Ω-cm ka wae. ʻoi aku ka nui o ka resistivity, ʻoi aku ka maikaʻi o nā waiwai insulating.
Volta hōʻike: ʻike ʻia hoʻi ʻo ka ikaika kūʻokoʻa (ka ikaika insulation), ʻoi aku ka kiʻekiʻe o ka uila i hoʻohui ʻia i nā wēlau o ka colloid, ʻoi aku ka nui o ka hoʻopiʻi ʻana i loko o ka mea i kau ʻia i ka ikaika o ke kahua uila, ʻoi aku ka nui o ka ionize i ka hui ʻana, ka hopena i ka haki ʻana o ka colloid. E hana i ka insulator breakdown o ka haʻahaʻa haʻahaʻa i kapaia ka mea o ka breakdown voltage. Hana i 1 mm mānoanoa insulating mea wawahi, pono e hoʻohui i ka volta kilovolts i kapaia insulating mea insulation kū i ka ikaika voli, i oleloia e like me ke kuʻe uila, ka wae: Kv/mm. insulating mea insulation a me ka wela ka pilina pili. ʻO ke kiʻekiʻe o ka mahana, ʻoi aku ka maikaʻi o ka hana insulation o ka mea insulating. I mea e hōʻoiaʻiʻo ai i ka ikaika o ka insulation, loaʻa i kēlā me kēia mea insulating kahi mahana hana kūpono i ʻae ʻia, i kēia mahana ma lalo nei, hiki ke hoʻohana palekana ʻia no ka manawa lōʻihi, ʻoi aku ka wikiwiki o kēia mahana.
Ka hoʻoheheʻe wai: He ana ia o ka nui o ke komo ana o ka wai. E pili ana ia i ka pākēneka o ka piʻi ʻana o ka nuipaʻa o kahi mea i hoʻokomo ʻia i loko o ka wai no kekahi manawa ma kahi mahana.
Ka ikaika tensile: ʻO ka ikaika tensile ke koʻikoʻi tensile kiʻekiʻe loa i ka wā e kikoo ʻia ka gel e haki. ʻIke ʻia hoʻi ʻo ka tensile force, tensile strength, tensile strength, tensile strength. ʻO MPa ka ʻāpana.
Ka ikaika shear: ʻike ʻia hoʻi ʻo ka ikaika shear, pili i ka ʻāpana hoʻopaʻa ʻāpana hiki ke kū i ka haʻawe kiʻekiʻe e like me ka wahi hoʻopaʻa, hoʻohana mau ʻia ka ʻāpana o MPa.
Ka ikaika ʻili: ʻike ʻia hoʻi ʻo ka ikaika peel, ʻo ia ka nui o ka hōʻeha pōʻino i kēlā me kēia ʻāpana ākea hiki ke kūpaʻa, ʻo ia ke ana o ka laina o ka mana ikaika, ʻo ka ʻāpana kN / m.
ʻO ka lōʻihi: e pili ana i ka colloid i loko o ka ikaika tensile ma lalo o ka hana o ka lōʻihi o ka hoʻonui i ka lōʻihi kumu o ka pakeneka.
Wela deflection wela: e pili ana i ke ana o ka wela o ka mea hoola mea, he mea hoola mea specimen i hoʻokomo 'ia i loko o keʻano o ka isothermal heat transfer medium kūpono no ka wela, i ka static bending haawe o ke kaola i kākoʻo wale 'ia, ana i ka specimen kulou deformation a hiki i ka mea i hoakakaia ka waiwai o ka wela, 'o ia hoʻi, ka wela deflection wela, i kapaia ka wela HDT deflection.
Ke aniani hoʻololi wela: e pili ana i ka mea i hoolaia mai ke ano aniani a hiki i ka hoololi aupuni amorphous a i ole elastic nui a i ole ka wai (a i ole ke ku e o ka hoololi) o ka laula wela haiki o ka lae waena kokoke, i ikeia o ka wela hoololi aniani, i hoike pinepine ia ma Tg, he mea hoike no ka pale wela.
ʻAi ʻai hoʻoemi: ho'ākāka 'ia e like me ka pakeneka o ka lakio o ka shrinkage i ka nui ma mua o shrinkage, a shrinkage ka okoa ma waena o ka nui ma mua a ma hope o shrinkage.
ʻO ke kaumaha o loko: e pili ana i ka nele o na ikaika o waho, ka colloid (mea) ma muli o ke alo o na hemahema, ka hoololi ana o ka wela, ka solvents, a me na kumu e ae no ke kaumaha o loko.
Kūleʻa kimemika: pili i ka hiki ke pale aku i ka waika, alkalis, paakai, solvents a me na mea kemika.
Kūʻē ahi: e pili ana i ka hiki o ka mea ke pale aku i ka puhi ahi i ka wa e pili ana me ka lapalapa ana a i ole e keakea i ka hoomau ana o ka puhi ana ke kaawale mai kahi lapalapa.
Kūleʻa i ka wā: e pili ana i ka ʻike ʻana i ka lā, ka wela a me ke anu, ka makani a me ka ua a me nā kūlana climatic ʻē aʻe.
ʻelemakule: ho'ōla i ka colloid i ka hana, mālama a me ka hoʻohana ʻana i ke kaʻina hana, ma muli o nā kumu o waho (wela, māmā, oxygen, wai, nā kukuna, nā mana mechanical a me nā mea hoʻonaninani kemika, a me nā mea ʻē aʻe), kahi ʻano o nā loli kino a i ʻole nā kemika, i hiki ai i ka polymer material crosslinking brittle, crack sticky, discoloration cracking, blistering blistering, surface chalking, delamination the gradual loss the performance of mechanical loss of gradual loss. ʻaʻole hoʻohana ʻia, ua kapa ʻia kēia ʻano he ʻelemakule. Ua kapa ʻia ke ʻano o kēia hoʻololi ʻana i ka ʻelemakule.
Dielectric mau: ʻike pū ʻia ʻo ka capacitance rate, induced rate (Permittivity). Hōʻike i kēlā me kēia "unit volume" o ka mea, i kēlā me kēia ʻāpana o ka "gradient hiki" hiki ke mālama i ka "ikehu electrostatic" (Electrostatic Energy) o ka Ehia. I ka colloid "permeability" i ka nui (ʻo ia hoʻi, ka ino o ka maikaʻi), a me elua kokoke i ka uea i kēia manawa hana, i ka oi paʻakikī e hiki i ka hopena o ka piha insulation, ma kekahi olelo, o ka oi aku paha e hana i kekahi degere o leakage. No laila, ʻo ka dielectric mau o ka mea insulating ma ka laulā, ʻoi aku ka liʻiliʻi o ka maikaʻi. ʻO ka dielectric mau o ka wai he 70, liʻiliʻi loa ka makū, e hoʻololi nui.
4. ka hapa nui o kaepoxy resin adhesivehe mea hoʻopili wela, aia nā hiʻohiʻona nui: ʻoi aku ka kiʻekiʻe o ka mahana ʻoi aku ka wikiwiki o ka hoʻōla ʻana; ʻO ka nui o ka hui ʻana o ka ʻoi aku ka wikiwiki o ka hoʻōla ʻana; He hanana exothermic ka hana ho'ōla.
ʻO Shanghai Orisen New Material Technology Co., Ltd
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