Nekuda kwehunhu hwe epoxy resins hunoshandiswa zvakasiyana-siyana, inoshandiswa zvakanyanya muma glues, mu potting, encapsulating electronics, uye muma printed circuit boards. Inoshandiswawo muchimiro chema matrices ema composites mumaindasitiri endege. Epoxy composite laminates inowanzo shandiswa kugadzirisa zvese zvivakwa zve composite pamwe nesimbi mumashandisirwo egungwa.
Epoxy resin 113AB-1 inogona kushandiswa zvakanyanya pakuputira furemu yemifananidzo, kuputira pasi kwekristaro, zvishongo zvakagadzirwa nemaoko, uye kuzadza mold, nezvimwewo.
Chinhu
Epoxy resin 113AB-1 inogona kurapwa kana tembiricha yakajairika, ine hunhu hwekusviba kushoma uye hunhu hwakanaka hwekuyerera, inobvisa tsvina pachisikigo, haitsvedzere yero, yakajeka, haina mafungu, inopenya pamusoro.
Zvivakwa zvisati zvaoma
| Chikamu | 113A-1 | 113B-1 |
| Ruvara | Kujeka | Kujeka |
| Simba regiravhiti rakanyatsojeka | 1.15 | 0.96 |
| Kusviba (25℃) | 2000-4000CPS | MAXCPS 80 |
| Chiyero chekusanganisa | A: B = 100:33 (chiyero chehuremu) |
| Mamiriro ekuomesa | 25 ℃×8H kusvika 10H kana 55℃×1.5H (2 g) |
| Nguva inoshandiswa | 25℃×40min (100g) |
Kushanda
1. Yera guruu reA neB zvichienderana nehuremu hwakapihwa mumudziyo wakagadzirwa wakachena, sanganisa musanganiswa wacho zvakare nemadziro emudziyo newachi, uise pamwe chete kwemaminitsi matatu kusvika mashanu, wozoshandisa.
2. Tora guruu zvichienderana nenguva inoshandiswa uye chiyero chemusanganiswa kuti usaparadze. Kana tembiricha iri pasi pe15 ℃, ndapota pisa guruu reA kusvika 30 ℃ kutanga wobva warisanganisa neguruu reB (Guu reA richakora kana tembiricha yakaderera); Guruu rinofanira kuvharwa chivharo mushure mekushandisa kudzivirira kurambwa kunokonzerwa nekunwa hunyoro.
3. Kana hunyoro hwacho hwapfuura 85%, pamusoro pemusanganiswa wakagadzirwa uchatora hunyoro mumhepo, woita mhute chena pamusoro, saka kana hunyoro hwacho hwapfuura 85%, husina kukodzera kupiswa kwetembiricha yemumba, kurudzira kushandisa kupisa.
